The rapid evolution of cloud computing, AI workloads, and distributed storage architectures has pushed data centers toward higher bandwidth and lower latency requirements. Within this transition, the OSFP112 400G VSR4 optical module has emerged as a strategic interface that bridges top-of-rack switches, spine infrastructure, and AI training clusters. It is designed specifically for short-reach applications, where stability, low power, and high signal integrity matter most.

Compared with previous generations of OSFP modules, the OSFP112 standard focuses on high electrical performance and improved thermal handling. As 100G-per-lane PAM4 becomes the mainstream electrical signaling method, the OSFP112 housing offers a more robust environment to support these high-frequency signals without compromising stability. The module’s enhanced heat dissipation also ensures more reliable operation when stacked in high-density switching platforms.
The “VSR4” classification identifies this module as a very short-reach optical solution based on multimode fiber. It is tailored for rack-to-rack or row-based connections where the physical distance is limited but the volume of data is extremely high. In today’s AI and HPC architectures, these links often serve as the backbone for GPU clusters, distributed inference engines, or horizontal data synchronization tasks. The VSR4 design optimizes the optical path for clean transmission over short distances while maintaining the efficiency required in energy-conscious data centers.
PAM4 modulation has become synonymous with 400G Ethernet because it enables a higher bit rate without dramatically increasing channel count. However, PAM4 is inherently more sensitive to noise and distortion. The OSFP112 400G VSR4 module integrates advanced DSP technology to mitigate signal degradation, equalize high-speed lanes, and support excellent eye-diagram performance. This allows the module to deliver reliable operation even in environments where electromagnetic noise, temperature fluctuation, or vibration must be carefully controlled.
In a modern spine-leaf data center architecture, short-distance optical modules handle the critical east-west traffic. The OSFP112 400G VSR4 is particularly suited for these environments. It delivers the bandwidth required for real-time load balancing, high-speed routing updates, and service scaling operations.
In AI training and inference scenarios, the module plays an equally important role. Workloads such as LLM training, distributed model updates, and memory-intensive parallel tasks rely heavily on dense, short-range optical fabrics. The VSR4 module provides the speed and consistency necessary to support synchronized computation across dozens or even hundreds of GPU nodes.
Modern data centers run 24/7 with minimal interruption. For this reason, the OSFP112 400G VSR4 is engineered with robust optical components, precise temperature control, and carefully tested PCB layouts. Every module undergoes performance verification to ensure stable operation under prolonged stress, heavy data load, and varying thermal conditions. This focus on reliability helps reduce maintenance frequency and minimizes the risk of unexpected downtime.
Although designed for 400G environments, the OSFP112 form factor has scalability built into its physical and electrical architecture. As 800G and even 1.6T optical technologies become mainstream, OSFP will remain a core standard due to its power capacity and cooling capability. The 400G VSR4 module therefore serves as a strategic stepping stone, enabling data centers to build a foundation that aligns with future high-bandwidth upgrades.
The OSFP112 400G VSR4 module is more than just a short-reach optical interface. It is a critical component enabling low-latency, high-density connectivity in environments where performance and scalability directly impact business outcomes. As cloud infrastructure, AI computing, and hyperscale networking continue to expand, solutions like the OSFP112 400G VSR4 will remain essential for maintaining reliable, high-speed data movement within next-generation architectures.
Headquarter address :Room 1603, Coolpad Building B, North District of Science and Technology Park, Nanshan District, Shenzhen,China.518057